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| 2N6344 Preferred Device Triacs Silicon Bidirectional Thyristors Designed primarily for full-wave ac control applications, such as light dimmers, motor controls, heating controls and power supplies; or wherever full-wave silicon gate controlled solid-state devices are needed. Triac type thyristors switch from a blocking to a conducting state for either polarity of applied main terminal voltage with positive or negative gate triggering. Features http://onsemi.com * Blocking Voltage to 800 V * All Diffused and Glass Passivated Junctions for Greater Parameter Uniformity and Stability TRIACS 8 AMPERES RMS 600 thru 800 VOLTS MT2 G MT1 * Small, Rugged, Thermowatt Construction for Low Thermal * * * Resistance, High Heat Dissipation and Durability Gate Triggering Guaranteed in all Four Quadrants For 400 Hz Operation, Consult Factory Pb-Free Package is Available* MARKING DIAGRAM MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Peak Repetitive Off-State Voltage (Note 1) (TJ = -40 to +110C, Sine Wave 50 to 60 Hz, Gate Open) 2N6344 2N6349 On-State RMS Current (TC = +80C) Full Cycle Sine Wave 50 to 60 Hz (TC = +90C) Peak Non-Repetitive Surge Current (One Full Cycle, Sine Wave 60 Hz, TC = +25C) Preceded and followed by rated current Circuit Fusing Consideration (t = 8.3 ms) Peak Gate Power (TC = +80C, Pulse Width = 2 ms) Average Gate Power (TC = +80C, t = 8.3 ms) Peak Gate Current (TC = +80C, Pulse Width = 2.0 ms) Peak Gate Voltage (TC = +80C, Pulse Width = 2.0 ms) Operating Junction Temperature Range Storage Temperature Range Symbol VDRM, VRRM 600 800 IT(RMS) ITSM 8.0 4.0 100 A 1 A 2 3 Value Unit V TO-220AB CASE 221A STYLE 4 2N6344G AYWW 4 I2t PGM PG(AV) IGM VGM TJ Tstg 40 20 0.5 2.0 10 -40 to +125 -40 to +150 A2s W W A Y WW G = Assembly Location = Year = Work Week = Pb-Free Package PIN ASSIGNMENT A V C C 1 2 3 4 Main Terminal 1 Main Terminal 2 Gate Main Terminal 2 Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. Indicates JEDEC Registered Data. 1. VDRM and VRRM for all types can be applied on a continuous basis. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded. *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2006 ORDERING INFORMATION Device 2N6344 2N6344G Package TO-220AB TO-220AB (Pb-Free) Shipping 500 Units / Box 500 Units / Box Preferred devices are recommended choices for future use and best overall value. 1 May, 2006 - Rev. 4 Publication Order Number: 2N6344/D 2N6344 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Case Maximum Lead Temperature for Soldering Purposes 1/8 from Case for 10 Sec Symbol RqJC TL Max 2.2 260 Unit C/W C ELECTRICAL CHARACTERISTICS (TC = 25C unless otherwise noted; Electricals apply in both directions) Characteristic OFF CHARACTERISTICS Peak Repetitive Blocking Current (VD = Rated VDRM, VRRM; Gate Open) TJ = 25C TJ = 100C ON CHARACTERISTICS Peak On-State Voltage (ITM = "11 A Peak; Pulse Width = 1 to 2 ms, Duty Cycle p2%) Gate Trigger Current (Continuous dc) (VD = 12 Vdc, RL = 100 W) Quadrant I: MT2(+), G(+) Quadrant II: MT2(+), G(-) Quadrant III: MT2(-), G(-) Quadrant IV: MT2(-), G(+) MT2(+), G(+); MT2(-), G(-) TC = -40C MT2(+), G(-); MT2(-), G(+) TC = -40C Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 100 W) Quadrant I: MT2(+), G(+) Quadrant II: MT2(+), G(-) Quadrant III: MT2(-), G(-) Quadrant IV: MT2(-), G(+) MT2(+), G(+); MT2(-), G(-) TC = -40C MT2(+), G(-); MT2(-), G(+) TC = -40C Gate Non-Trigger Voltage (Continuous dc) (VD = Rated VDRM, RL = 10 k W, TJ = 100C) MT2(+), G(+); MT2(-), G(-); MT2(+), G(-); MT2(-), G(-) Holding Current (VD = 12 Vdc, Gate Open) (Initiating Current = "200 mA) TC = 25C *TC = -40C Both 2N6349 only Both 2N6349 only VTM IGT - - - - - - VGT Both 2N6349 only Both 2N6349 only - - - - - - VGD 0.2 IH tgt - - - - 6.0 - 1.5 - 40 75 2.0 mA ms 0.9 0.9 1.1 1.4 - - 2.0 2.5 2.0 2.5 2.5 3.0 V 12 12 20 35 - - 50 75 50 75 100 125 V - 1.3 1.55 V mA IDRM, IRRM - - - - 10 2.0 mA mA Symbol Min Typ Max Unit Turn-On Time (VD = Rated VDRM, ITM = 11 A, IGT = 120 mA, Rise Time = 0.1 ms, Pulse Width = 2 ms) DYNAMIC CHARACTERISTICS Critical Rate of Rise of Commutation Voltage (VD = Rated VDRM, ITM = 11 A, Commutating di/dt = 4.0 A/ms, Gate Unenergized, TC = 80C) Indicates JEDEC Registered Data. dv/dt(c) - 5.0 - V/ms http://onsemi.com 2 2N6344 Voltage Current Characteristic of Triacs (Bidirectional Device) + Current Quadrant 1 MainTerminal 2 + Symbol VDRM IDRM VRRM IRRM VTM IH Parameter Peak Repetitive Forward Off State Voltage Peak Forward Blocking Current Peak Repetitive Reverse Off State Voltage Peak Reverse Blocking Current Maximum On State Voltage Holding Current Quadrant 3 MainTerminal 2 - IH VTM IRRM at VRRM on state IH VTM off state + Voltage IDRM at VDRM Quadrant Definitions for a Triac MT2 POSITIVE (Positive Half Cycle) + (+) MT2 (+) MT2 Quadrant II 2N6349 only (-) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant I Both IGT - (-) MT2 (-) MT2 + IGT Quadrant III Both (-) IGT GATE MT1 REF (+) IGT GATE MT1 REF Quadrant IV 2N6349 only - MT2 NEGATIVE (Negative Half Cycle) All polarities are referenced to MT1. With in-phase signals (using standard AC lines) quadrants I and III are used. http://onsemi.com 3 2N6344 100 PAV , AVERAGE POWER (WATTS) = 30 TC , CASE TEMPERATURE ( C) 96 60 90 92 84 80 = CONDUCTION ANGLE dc 120 180 88 10 8.0 = CONDUCTION ANGLE 60 TJ [ 100C 30 90 dc = 180 120 6.0 4.0 2.0 0 0 1.0 3.0 4.0 5.0 6.0 IT(RMS), RMS ON-STATE CURRENT, (AMP) 2.0 7.0 8.0 0 1.0 5.0 2.0 3.0 4.0 6.0 IT(RMS), RMS ON-STATE CURRENT (AMP) 7.0 8.0 Figure 1. RMS Current Derating Figure 2. On-State Power Dissipation 1.8 Vgt , GATE TRIGGER VOLTAGE (VOLTS) 1.6 1.4 QUADRANT 4 1.2 1.0 0.8 0.6 0.4 -60 -40 -20 1 QUADRANTS 2 3 0 20 40 60 80 100 TJ, JUNCTION TEMPERATURE (C) 120 140 I GT , GATE TRIGGER CURRENT (mA) OFF-STATE VOLTAGE = 12 V 50 OFF-STATE VOLTAGE = 12 V 30 20 10 7.0 QUADRANT 1 2 3 4 5.0 -60 -40 -20 0 20 40 60 80 100 TJ, JUNCTION TEMPERATURE (C) 120 140 Figure 3. Typical Gate Trigger Voltage Figure 4. Typical Gate Trigger Current http://onsemi.com 4 2N6344 100 I H , HOLDING CURRENT (mA) 70 50 30 20 i TM , INSTANTANEOUS ON-STATE CURRENT (AMP) TJ = 100C 10 7.0 5.0 3.0 2.0 100 1.0 0.7 0.5 0.3 0.2 I TSM , PEAK SURGE CURRENT (AMP) 80 20 GATE OPEN MAIN TERMINAL #1 POSITIVE 10 7.0 5.0 MAIN TERMINAL #2 POSITIVE 3.0 2.0 -60 25C -40 -20 60 0 20 40 80 100 TJ, JUNCTION TEMPERATURE (C) 120 140 Figure 6. Typical Holding Current 60 CYCLE TJ = 100C f = 60 Hz Surge is preceded and followed by rated current 1.0 2.0 3.0 5.0 NUMBER OF CYCLES 7.0 10 40 20 0 0.1 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 3.6 4.0 vTM, INSTANTANEOUS ON-STATE VOLTAGE (VOLTS) 4.4 Figure 5. On-State Characteristics Figure 7. Maximum Non-Repetitive Surge Current r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) 1.0 0.5 0.2 0.1 0.05 ZqJC(t) = r(t) * RqJC 0.02 0.01 0.1 0.2 0.5 1.0 2.0 5.0 20 50 t,TIME (ms) 100 200 500 1.0 k 2.0 k 5.0 k 10 k Figure 8. Typical Thermal Response http://onsemi.com 5 2N6344 PACKAGE DIMENSIONS TO-220AB CASE 221A-07 ISSUE AA -T- B F C SEATING PLANE T S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED. DIM A B C D F G H J K L N Q R S T U V Z INCHES MIN MAX 0.570 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.147 0.095 0.105 0.110 0.155 0.014 0.022 0.500 0.562 0.045 0.060 0.190 0.210 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 0.045 --- --- 0.080 MILLIMETERS MIN MAX 14.48 15.75 9.66 10.28 4.07 4.82 0.64 0.88 3.61 3.73 2.42 2.66 2.80 3.93 0.36 0.55 12.70 14.27 1.15 1.52 4.83 5.33 2.54 3.04 2.04 2.79 1.15 1.39 5.97 6.47 0.00 1.27 1.15 --- --- 2.04 4 Q 123 A U K H Z L V G D N J R STYLE 4: PIN 1. 2. 3. 4. MAIN TERMINAL 1 MAIN TERMINAL 2 GATE MAIN TERMINAL 2 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 6 2N6344/D |
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